Electronic Devices Failures

Electronic Device Failure Analysis | Soldering Failure | Chip Failure

Electronic Devices Failures

As the miniaturization of electronic components progresses, so do the challenges in making the devices reliable and accurate. Under such conditions it becomes extremely important to find whether the electronic device failure is limited to an isolated piece under investigation (because of unusual service conditions or an inherent weakness) or if the problem is more systemic and requires re-design/ manufacturing considerations. An electronic device failure could be because of localized environment like dust, humidity, chemicals, and vibrations. It could also be due to design and/ or manufacturing aspects such as from deficient selection of encapsulating material, overstressing (thermal or electrical), cracking of bond wires, inter-metallic diffusion, insulation failure, etc. ITS can reliably investigate the cause of electronic device failures using state-of-art equipment such as optical, infrared and scanning electron microscopes, Energy Dispersive Spectroscopy, micro-probing Thermal Imaging, and Non Destructive Testing.

Electronic Device Electronic Device

Our approach to electronic device failures may include

  • Analysis of the material of construction
  • Process by which the electronic device was manufactured
  • Study of component history
  • Visual examination/ fractography
  • Dimensional measurements
  • Microscopic examination of material samples
  • Micro Hardness
  • Scanning Electron Microscopy and Energy Dispersive Spectroscopy

Based on all our observations and analysis, the client is provided with the detailed report that is conclusive, accurate and well illustrated for technical and non technical readers.